Semiconductor Packaging

Screen printing is one of the critical process technologies in advanced semiconductor packaging. Through high-precision and highly stable printing equipment combined with rigorous process control, we are able to achieve fine and reliable material printing on various packaging substrates. This technology is applicable to a wide range of advanced packaging types, including Wafer-Level Packaging (WLP), Panel-Level Packaging (PLP), Flip Chip, Chip-Scale Packaging (CSP), and System-in-Package (SiP).

Our screen printing process supports a variety of key applications, including solder paste printing, conductive epoxy dispensing, underfill dam patterning, dam structure formation, peelable mask application, and redistribution layer (RDL) pattern printing. These capabilities not only enhance package reliability but also significantly improve backend yield and production efficiency, making screen printing an essential enabler for heterogeneous integration in next-generation semiconductor packaging.